Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

What are the qualifications of the people conducting IDTechEx research? Content produced by IDTechEx is researched and written by our technical analysts, each with a PhD or master's degree in their ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

This effort will be spearheaded by the Malaysia Advanced Packaging Consortium, formed by five local companies in ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

BILLERICA, Mass.--(BUSINESS WIRE)-- Bruker Corporation (Nasdaq: BRKR) today announced the shipment and installation of the 15th InSight WLI 3D optical metrology system to a leading semiconductor ...

SANTA CLARA, Calif., Feb. 7, 2025 /PRNewswire/ — LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal ...

Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates for ...

According to Dr. Richard Thurston, CEO of GLS, the partnership leverages both companies' technology portfolios by tightly integrating GLS's proprietary chip fabrication processes with advanced ...

Taiwan Semiconductor Manufacturing Co. plans to open an advanced chip packaging facility in Arizona before 2029, adding CoWoS and 3D-IC capabilities critical for AI chips used by Nvidia and Apple. The ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...