Manufacturers of ball-grid-array (BGA) burn-in sockets are using a variety of processes to help them keep pace with the testing requirements posed by today's faster and denser integrated circuits.

Eagan, Minn. — Ironwood Electronics has introduced a new high pin count BGA SMT adapter set that includes the SF-BGA1936A-B-42, female socket with machined pins, and LS-BGA1936A-41 male socket, for ...

Series 700, 0518, and 0501 RoHS-compliant sockets are specifically designed for high-pin-count or off-centered components for socketing DIPs with nonstandard row-to-row dimensions and elevating ...

Ironwood Electronics introduced a new high-performance elastomer socket for 0.5-mm-pitch ball-grid-array (BGA) packages. The CG15-BGA-1003 socket is designed for a 10- x 5.7-mm package size. It ...

Assuming position as one of the largest, full-pattern-capable, open-top sockets available, the 3M Textool brand Type IV, 0.8-mm, open-top BGA test and burn-in socket now accepts packages on a 0.8-mm ...

The test sockets, which are crucial components that directly interface with semiconductor IC packages, have a profound impact on device testing performance. Pins with high CRES not only cause false ...

Smiths Interconnect is thrilled to announce that its DaVinci 112 high-speed test socket received the prestigious Best Test Measurement Award of the Year at the Global Electronics Achievement Awards ...