For the PDF version of this article, click here. The penetration of semiconductors inside an automobile is forecasted to increase rapidly in the coming years. Today, a high-end car is estimated to ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Digital Matrix Corporation, recognized leader in precision electroforming and electroplating technology, today announced the spin-off of its advanced research and development group. The new company is ...